Back Issues

JUL/AUG 2013  

Follow us:

Find MICROmanufacturing on TwitterFind MICROmanufacturing on FacebookFind MICROmanufacturing on YouTubeMICROmanufacturing RSS feed

ESI high-precision micromanufacturing systems

Company

ESI

503.641.4141


Electro Scientific Industries Inc.'s newest microfabrication platforms use specialized lasers capable of rapidly drilling and routing in most metals, organics, dielectrics, semiconductors and hybrid-engineered materials.

Here are some of the microfabrication systems offered by ESI.

esi 5390 

The ESI Model 5390 features a new high power CO2 laser with variable pulse width and high pulse repetition frequency of up to 300 kHz. This system can achieve Via diameters down to 60µm.

esi mm5800

ESI’s MM5800 dual-beam laser micromachining system incorporates two high-power fiber lasers specifically designed for industrial use. This system offers programmable spacing between the two beams, which results in optimal machining speed depending upon the part’s layout.

esi Si5330

The Model Si5330 is a heavy-duty solution optimized for precision high-aspect-ratio controlled-depth and through Vias in silicon. The Si5330 micromachining system uses a high-power UV laser capable of rapidly drilling and routing in most semiconductors. It can achieve drill rates of up to 2,000 Via per second, depending on the material’s thickness and Via size.

 esi ml5900

The Model ML5900 is an advanced, high-precision system that is optimized for industrial-production of complex geometries in a wide-range of materials. Featuring a high-power, interchangeable diode-pumped IR, Green or UV laser, the system enables component and OEM manufacturers to drill, route and nanostructure a wide range of materials including metals, organics, dielectrics, semiconductors and hybrid-engineered parts.

esi mm5330

The Model MM5330 laser micromachining system is optimized for drilling and profiling in metals such as Aluminum. This system incorporates a high-power diode-pumped 532nm laser designed specifically for industrial applications. Via drill rates up to 2,000 Vias per second are achievable, depending on the material’s thickness and size.

Click here for more information.